Low pressure molding (lpm)

What is Low Pressure Molding?

Low pressure molding is a technology used for polyamide molding. Low pressure molding (LPM) technology is typically used to encapsulate components, such as electronic circuits, sensors, cable conductors (attachments), tool handholds …

The layer surrounding the component serves as protective coating and safeguards it against external impacts, such as moisture, dust, vibrations, mechanical damage …

Main advantages of this low pressure molding technology (LPM) are:

• lower molding pressure (3.5-15 bar),
• lower temperature of inlet mass (180-210 °C), use of simpler tools,
• is suitable for small-scale production.

Characteristics of low pressure molding

• For low pressure molding we use a simple tool, which is usually ten times cheaper than in conventional high pressure molding. Therefore, this technology is suitable for small-scale production and production that permits smaller dimensional deviations.

• It is a small-scale production that can be upgraded to mass production in the future through automation.

• We use several types of materials with different mechanical properties. Most of these materials are suitable for encapsulating various products from materials such as metals and some plastics. We only use certified materials in our production.

• Available foradditional operations such as: soldering, instalation of shrink tubes and other cable terminations.